General - man at scope 20190328_IMT-3276


Testing is critical to MEMS fabrication. Ultimately, IMT needs to deliver wafers or devices that meet customer specifications.

We offer the ability to adapt our tests to fit our customers’ specific application needs. The immediate feedback reduces development time and improves process optimization. Ultimately, this leads to faster time to market and better performance.

In order to do so, IMT needs to test devices and control processes using metrology and other failure analysis techniques.

Metrology and Failure Analysis

The ability to obtain characteristics and measurements of devices and materials helps in verifying wafer processing and failure analysis. IMT’s comprehensive metrology capability allows us to measure cross-section, CDs, thickness, width, optical, roughness, reflectivity, composition, etc. The following lists some of the capabilities at IMT:

  • FIB-SEM with EDX
  • Optical profiler/interferometer
  • Stylus profiler
  • Spectrophotometer
  • Automatic pattern recognition systems
  • AFM
  • FTIR
  • Ellipsometer
  • XRF
  • FE-SEM
  • Resmap
  • SurfScan particle detection

Automated Electric Probing

In-process electrical testing of wafers includes various measurements, such as:

  • Capacitance
  • Resistance
  • Inductance
  • Isolation
  • High potential

Having this knowledge enables saving costs of producing devices. The end customer would only receive known-good-dies. IMT also offers reliability, environmental, and life testing, as well as other custom testing specific to individual customer’s applications.